Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System

Chan, Sook Chien (2002) Effects Of Intermetallic Growth And Bonding Parameters On Wire- Bond Strength For Gold - Aluminium System. Masters thesis, Multimedia University.

Full text not available from this repository.
Official URL: http://myto.perpun.net.my/metoalogin/logina.php

Abstract

The effect of gold -aluminum intermetallic growth at elevated temperatures on bond shear strength is studied. A diffusion model is derived from the Fick's first law for verifying with the measurement of gold-aluminum diffusion reaction rate.

Item Type: Thesis (Masters)
Subjects: T Technology > TK Electrical engineering. Electronics Nuclear engineering > TK7800-8360 Electronics
Divisions: Faculty of Engineering (FOE)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 13 Jul 2010 03:06
Last Modified: 13 Jul 2010 03:06
URI: http://shdl.mmu.edu.my/id/eprint/944

Actions (login required)

View Item View Item