Citation

Mhd Noor, Ervina Efzan and Kamaneeya, R. (2018) Corrosion of Sn-Zn-Bi lead free solder in KOH electrolyte. Solid State Phenomena, 273. pp. 51-55. ISSN 1662-9779

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Abstract

The corrosion of Sn-Zn-Bi lead free solder in 6M KOH electrolyte was conducted. The study was done using 3 different KOH concentrations (3M, 6M and 9M) and the immersion technique was used to produce corrosion. Due to the nature of immersion, the solder material was prepared by punching it into small billets size after melting it homogenously on a commercial hotplate. The immersion was set to 7, 14 and 21 days. After the specific days have fulfilled the sample billets were removed and tested. The corrosion of this solder was measured using various method such as graphical analysis, surface roughness, corrosion penetration rate (CPR) and optical microscope. In this research, it was found out that the sample billets taken from 6M concentration compared to 3M and 9M showed more corrosion this was supported by the outcome of the test. The 6M believed to provide best corrosion on the solder billets because of its high ionic conductivity value.

Item Type:	Article
Uncontrolled Keywords:	Solder, corrosion, Sn-Bi, wettability
Subjects:	T Technology > TA Engineering (General). Civil engineering (General) > TA401-492 Materials of engineering and construction. Mechanics of materials
Divisions:	Faculty of Engineering and Technology (FET)
Depositing User:	Ms Suzilawati Abu Samah
Date Deposited:	16 Aug 2021 15:12
Last Modified:	16 Aug 2021 15:12
URII:	http://shdl.mmu.edu.my/id/eprint/7696

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