Effects of Wetting Behavior on Gallium Addition in In-Zn Solder Alloy


Mhd Noor, Ervina Efzan and Mhd Nasir, Nur Faziera (2016) Effects of Wetting Behavior on Gallium Addition in In-Zn Solder Alloy. Materials Science Forum, 857. pp. 22-25. ISSN 1662-9752

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This paper reported the investigation on gallium, Ga addition into In-4.8Zn lead-free solder to improve its wettability performances. The effect of addition of Ga in In-4.8Zn solder alloy was studied. The results show with the addition of 0.5% Ga into the In-4.8Zn composition, the spreading area of In-4.8Zn-0.5Ga solder on copper increase between 35.71 and 43.75 %. Hence, as the spreading area increases, the contact angle decreased from between 22.09 to 39.71 %. Additionally, the addition of Ga as dopant increased the thickness of IMCs laye

Item Type: Article
Uncontrolled Keywords: Contact Angle, Dopant, Lead Free Solder, Spreading Area, Wettability
Subjects: Q Science > QC Physics > QC170-197 Atomic physics. Constitution and properties of matter Including molecular physics, relativity, quantum theory, and solid state physics
Divisions: Faculty of Engineering and Technology (FET)
Depositing User: Ms Rosnani Abd Wahab
Date Deposited: 06 Aug 2018 11:47
Last Modified: 06 Aug 2018 11:47
URII: http://shdl.mmu.edu.my/id/eprint/6722


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